Your project will be thermal analysis of a Flipchip package. You need to perform
Your project will be thermal analysis of a Flipchip package. You need to perform the following parametric studies to find
) maximum temperature,
2) Convection Heat dissipation path on the lid and substrate,
3) radiation heat dissipation on the lid
4) Temperature through-the-thickness of the package
prepare your IEEE report. Take a look at sample papers to get some idea how to write your reports
Material parametric study:
-Solder type: SAC305 vs SnCu (note: all of these materials are already defined in the Engineering Data of the project)
-Underfill: UF vs UF2 vs UF3 (note: all of these materials are already defined in the Engineering Data of the project)
-Lid material: Copper vs Stainless steel vs Aluminum): (note: Copper and Stainless steel are already defined in the Engineering Data of the project and you need
to define Aluminum by yourself)
-TIM thermal conductivity (. vs .3 vs .5) W/m-K
Loading parametric study:
-Uniform Power (Heat flow): (5,0, and 20W) (note, Default value applied in the demo is 0W)
-Convection coefficient value: 0 vs 00 vs 000 W/(m2 K) (default value in the demo is 00 W/(m2 K)
-radiation emissivity (0.2 vs 0.4 vs 0.6) (default value in the demo is 0.2)
Geometry parametric study:
Lid Thickness: (.25, .5, 2mm), demo: .25
TIM thickness: (50, 75, 00 um), demo: 50um (note: keep lid thickness .25 in this case)
Substrate core thickness: 0.4, 0.5, 0.6, demo is 0.4. Note: keep the total substrate thickness the same and change the core thickness only and therefore you need to reduce the build up thickness on both side)
Bulk silicon thickness: (0.7, 0.5, 0.3), demo value is 0.7 (do not change the lid thickness of .25, shift the lid to bottom when using thinner die)
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